Honor Pad X9

Pad X9

Perbandingan Spesifikasi

JARINGAN

Teknologi No cellular connectivity
2G N/A
3G N/A
4G N/A
GPRS No
EDGE No

UMUM

Diumumkan 2023, July 06
Status Available. Released 2023, July 06
Dimensi 267.3 x 167.4 x 6.9 mm (10.52 x 6.59 x 0.27 in)
Berat 495 g (1.09 lb)
SIM No

LAYAR

Tipe TFT LCD, 120Hz
Ukuran 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
Resolusi 1200 x 2000 pixels, 5:3 ratio (~203 ppi density)

PLATFORM

OS Android 13, MagicOS 7.1
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm)
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
GPU Adreno 610

MEMORI

Slot Kartu No
Internal 128GB 4GB RAM

KAMERA

Utama 5 MP, f/2.2, AF
Fitur HDR
Video 1080p@30fps
Depan 5 MP, f/2.2

KONEKTIVITAS

WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE
GPS Unspecified
NFC No
Radio No
USB USB Type-C, OTG

FITUR

Sensor Accelerometer

BATERAI

Detail Li-Po 7250 mAh, non-removable

LAIN-LAIN

Warna Space Gray
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