Honor Magic V3

Magic V3

Perbandingan Spesifikasi

JARINGAN

Teknologi GSM / CDMA / HSPA / CDMA2000 / LTE / 5G
2G GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
3G HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
4G 1, 2, 3, 4, 5, 7, 8, 12, 17, 18, 19, 20, 26, 28, 34, 38, 39, 40, 41, 66
Kecepatan HSPA, LTE, 5G

UMUM

Diumumkan 2024, July 12
Status Coming soon. Exp. release 2024, July 19
Dimensi Unfolded: 156.6 x 145.3 x 4.35 mm or 4.4 mm
Folded: 156.6 x 74.0 x 9.2 mm or 9.3 mm
Berat 226 g or 230 g (7.97 oz)
SIM Nano-SIM, eSIM or Dual SIM (Nano-SIM, dual stand-by)

LAYAR

Tipe Foldable LTPO OLED, 1B colors, 120Hz, 1800 nits (peak)
Ukuran 7.92 inches, 201.6 cm2 (~88.6% screen-to-body ratio)
Resolusi 2156 x 2344 pixels (~402 ppi density)

PLATFORM

OS Android 14, MagicOS 8.0.1
Chipset Qualcomm SM8650-AB Snapdragon 8 Gen 3 (4 nm)
CPU Octa-core (1x3.3 GHz Cortex-X4 & 3x3.2 GHz Cortex-A720 & 2x3.0 GHz Cortex-A720 & 2x2.3 GHz Cortex-A520)
GPU Adreno 750

MEMORI

Slot Kartu No
Internal 256GB 12GB RAM, 512GB 16GB RAM, 1TB 16GB RAM

KAMERA

Utama 50 MP, f/1.6, (wide), 1/1.56", PDAF, OIS
50 MP, f/3.0, (telephoto), 1/2.51", PDAF, 3.5x optical zoom, OIS
40 MP, f/2.2, 112˚, (ultrawide), AF
Fitur LED flash, HDR, panorama
Video 4K@30/60fps (10-bit), 1080p@30/60fps, gyro-EIS, HDR10+, OIS
Depan 20 MP, f/2.2, 90˚, (wide)
Cover camera:
20 MP, f/2.2, 90˚, (wide)

KONEKTIVITAS

WLAN Wi-Fi 802.11 a/b/g/n/ac/6e/7, dual-band, Wi-Fi Direct
Bluetooth 5.3, A2DP, LE, aptX HD, LDAC
GPS GPS (L1+L5), GLONASS (L1), BDS (B1I+B1c+B2a), GALILEO (E1+E5a)
NFC Yes; NFC-SIM, HCE
Radio No
USB USB Type-C 3.1, OTG, Display Port 1.2

FITUR

Sensor Fingerprint (side-mounted), accelerometer, gyro, proximity, compass, barometer

BATERAI

Detail Si/C 5150 mAh, non-removable

LAIN-LAIN

Warna Velvet Black, Snow, Tundra Green, Red
Note: Arenagadget tidak menjamin informasi pada halaman ini benar 100%.

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